- Building 6, Section 2, Yingshui Villa, Longhua District, Shenzhen, Guangdong
- +8613424013606
- info@meraif.com
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Engineered for electronic manufacturers, our SPI machines provide precise paste thickness inspection to reduce rework rates.
Our high-precision solder paste inspection machine (SPI) is designed for SMT production lines to ensure the accuracy of solder paste application and improve PCB production quality.
Our High Precision Solder Paste Inspection Machine (SPI) uses advanced imaging and intelligent algorithms for precise solder paste inspection. Designed for PCB manufacturing, it ensures accurate thickness, alignment, and quality. Ideal for electronics, automotive, telecommunications, and home appliances, the SPI improves production quality, reduces rework, and boosts efficiency.
Precise Detection for Superior Soldering Quality
Using advanced imaging sensors and high-resolution optics, this SPI machine offers ±1 micron detection accuracy, ensuring uniform solder paste thickness and minimizing defects, reducing the risk of short circuits.
High-Speed Automation to Boost Production Efficiency
Our automated SPI machine inspects up to 500 PCBs per minute, reducing manual intervention, increasing speed, and boosting production throughput while minimizing downtime.
Real-Time Feedback for Quick Issue Identification
The system provides real-time inspection reports on solder paste thickness and positional deviations, allowing operators to quickly identify issues and adjust parameters to prevent defects.
Flexible Configuration to Meet Diverse Production Needs
The machine supports various PCB sizes (single-sided, double-sided, and multilayer) and can be customized for both small-batch and large-scale production needs.
Cost-Effective, High ROI
This machine reduces paste waste and rework, optimizing production and cutting costs. Its consistent soldering quality ensures long-term savings and a strong return on investment.
Automated inspection reduces human error and boosts production speed
Real-time inspection reports enable quick adjustments, cutting down on defects and waste.
PCB SIZE: 50×50mm-510×460mm
thickness: 0.5mm -6mm
Component height: top: 40mm, bottom: 40mm
Process edge: 3mm
camera: 5MP color array high-speed industrial camera 5MP
Light source: RGB+W four-color integral light source + unidirectional structured light projection unit
Resolution: 15um
FOV: 15um@36*30mm
Solder detection: tin height, more tin, less tin, offset, pull tip, tin connection, tin type, coplanarity, etc.
Barcode recognition: one-dimensional/two-dimensional code recognition/character recognition, etc.
Mixed board test: mixed board production, support program automatic call
Algorithm: deep neural network algorithm, image comparison, color comparison, contour recognition, etc.
Speed: 0.3sec/FOv
Function: remote control, remote assistance, gerber file import, Custom model training
Communication method: standard SMEMA interface
Data output: automatically generate statistical analysis SPC
Host: industrial control host
Display: 24-inch FHD indicator display
Motion mechanism: high-precision screw + servo motor
Track width adjustment: manual/automatic
Power supply and power: AC 220V, rated power
Air source: 0.4-0.6Mpa
Working environment: temperature: 10-45℃, humidity: 30-85%RH
Chassis size and weight: 1020×1308×1611mm (excluding three-color light) about 760KG
Our High Precision Solder Paste Inspection Machine is designed to help manufacturers improve product quality, reduce soldering defects, and increase production efficiency. Whether for small-batch runs or large-scale manufacturing, this machine offers precise, high-speed solder paste inspection, ensuring excellent soldering quality while reducing waste and costs. It is the ideal solution for electronics, automotive, telecommunications, and industrial applications.
Improve production efficiency at a lower cost, reduce waste and rework, and help you achieve a higher return on investment
